Process Development Engineer (d/m/f) Chip Singulation
Process Development Engineer (d/m/f) Chip Singulation
<body> <h1>Process Development Engineer (d/m/f) Chip Singulation</h1> <h2>OSRAM GmbH, Regensburg</h2> <p> Bringing intelligence to light and passion to innovation The ams OSRAM Group is a global leader in optical solutions. By adding intelligence to light and passion to innovation, we enrich peoples' lives. This is what we mean by Sensing is Life. Our around 26,000 employees worldwide focus on innovation across sensing, illumination and visualization to make journeys safer, medical diagnoses more accurate and daily moments in communication a richer experience. Process Development Engineer (d/m/f) Chip Singulation Location: Regensburg Your Duties Process development and optimization in the field of chip singulation by laser dicing, laser grooving or wafer sawing and associated support processes (e.g., tape processes, application of protection coatings) Development and transfer of cost-efficient, fully automated, and robust processes for large-scale production Process improvements on existing production tools, including the evaluation and introduction of new processes, materials, and equipment - also in cooperation with equipment manufacturers Participation in cross-functional project and problem-solving teams Qualification and characterization of the materials and process media 30 days vacation entitlement Attractive salary and our company pension scheme Christmas- and vacation bonus Flexible working hours Flexible home office arrangements to promote a healthy work-life balance Your Qualifications Successfully completed master study of engineering (e.g., microsystems technology), material science or physics, PhD an advantage Professional experience in an industrial environment, such as the semiconductor industry, advantageous Strong physical and chemical understanding of semiconductor processes (wafer processing) and knowledge of relevant analytical methods Knowledge in one or more of the following processes advantageous: wafer sawing, laser dicing, laser grooving, tape processes, coating technology or other mechanical wafer processes Experience in tool procurement (evaluation, creation of specifications) Excellent communication and team skills, analytical thinking, and creativity, as well as a structured way of working Good knowledge of German and English Occasional willingness to travel You will benefit from flexible working time schedules and workplace arrangements an attractive salary as well as our company pension scheme a wide-ranging offer of further education and training corporate sports activities and special rates Apply now and advance your career in a position that challenges you professionally and provides you with many benefits. Apply now We are happy to answer your questions via email: career@ams-osram.com Find out more about your career prospects at OSRAM: careers.ams-osram.com Facebook Twitter YouTube Xing Xing LinkedIn Instagram Kununu Kununu Glassdoor </p> </body>